As electronic devices shrink, Bottom Termination Components (BTCs) have become indispensable due to their small footprint, low cost, and excellent thermal performance. However, because their connections are hidden underneath the component body, they present unique manufacturing challenges that IPC-7093A directly addresses:
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Detailed guidance on using Automated X-ray Inspection (AXI) , which is essential since the solder joints of BTCs are not visible to the naked eye or standard optical inspection. ipc-7093a pdf
The is a critical technical standard titled "Design and Assembly Process Implementation for Bottom Termination Components (BTCs)" . It focuses on the implementation of components like QFN , DFN , and LGA , where connections are on the bottom of the package. Essential Summary of IPC-7093A As electronic devices shrink